Fairchild FDC6329L Manuals

ManualLib has 2 documents for the Fairchild FDC6329L (Other Electronics): 1 application note, 1 datasheet. Every file can be read online or downloaded as a PDF for free.

Application Note 1Datasheet 1

Key facts

Model
FDC6329L
Documents
2
Languages
EN
Last added
2012-07-12

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Fairchild Semiconductor FDC6329L Thermal Analysis Application Note

Fairchild Semiconductor FDC6329L Thermal Analysis Application Note

Application Note 11 pages · 1.4 MB · EN

This document presents SPICE simulation results for the FDC6329L, specifically analyzing dynamic waveforms and the relationship between voltage drop (Vdrop) and load current (IL). It also includes measured dynamic waveform data for the device. The text is primarily in English, with the title containing Chinese characters.

The document details the heat flow theory applied to power MOSFETs, explaining how junction temperature is elevated by current and how thermal limits are determined. It defines steady-state junction-to-ambient thermal resistance (RθJA) and junction-to-case thermal resistance (RθJC), discussing factors affecting these values such as mounting pad size, PCB material, and leadframe design. Additionally, it describes methods for measuring transient thermal resistance using the intrinsic diode voltage and K factor calibration.

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Fairchild FDC6329L specifications

Device TypePower MOSFET
Thermal Resistance FormulaRθJA = ( TJ - TA ) / P
K Factor Approximation2.2mV/°C
PCB Conductivity0.29 W/m-C

Source: Fairchild Semiconductor FDC6329L Thermal Analysis Application Note

All Fairchild FDC6329L documents by type

Application Note 1

How to use the product for one specific task, with worked examples.

Datasheet 1

Ratings, dimensions and ordering codes, for selection and design work.

Questions answered in these manuals

What is the K factor for most Power MOSFET devices?

The K factor is approximately 2.2mV/°C for most Power MOSFET devices.

From: Fairchild Semiconductor FDC6329L Thermal Analysis Application Note

How is the steady-state junction-to-ambient thermal resistance defined?

It is defined as the ratio of the difference between junction temperature and ambient temperature to the power applied to the device.

From: Fairchild Semiconductor FDC6329L Thermal Analysis Application Note

What is the continuous load current capability?

The device supports a continuous load current of 2.5A.

From: Fairchild Semiconductor FDC6329L Integrated Load Switch Datasheet

What is the input voltage range?

The input voltage range is from 2.5V to 8V.

From: Fairchild Semiconductor FDC6329L Integrated Load Switch Datasheet