Key facts
- Brand
- Fairchild
- Model
- MicroFET 1.6x1.6mm
- Category
- Other Electronics
- Documents
- 2
- Languages
- EN
- Last added
- 2012-07-12
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Fairchild MicroFET 1.6x1.6mm Assembly Guidelines Application Note
This application note provides assembly guidelines for the Fairchild MicroFET 1.6x1.6mm package, which is based on Molded Leadless Packaging (MLP) technology. The document focuses on soldering and back-end processing to ensure reliable performance in power-related applications.
Key topics include PWB design considerations such as pad dimensions and material selection (lead-free FR-4), stencil design for paste printing, and the use of specific lead-free solder pastes like SAC 305. The note also details reflow profiles, voiding criteria (suggesting a maximum of 25% macro voiding), and recommendations regarding component reuse after rework.
Fairchild MicroFET 1.6x1.6mm specifications
| Package Technology | Molded Leadless Packaging (MLP) |
|---|---|
| Peak Reflow Temperature | 260°C |
| Maximum Macro Voiding | 25% |
| Recommended Solder Alloy | SAC 305 (96.5Sn/3.0Au/0.5Cu) |
| Recommended PWB Material | Lead-free FR-4 |
Source: Fairchild MicroFET 1.6x1.6mm Assembly Guidelines Application Note
All Fairchild MicroFET 1.6x1.6mm documents by type
How to use the product for one specific task, with worked examples.
Questions answered in these manuals
What is the maximum allowable macro voiding for this package?
Fairchild suggests a maximum of 25% voiding for MLP type packages based on reliability studies.
From: Fairchild MicroFET 1.6x1.6mm Assembly Guidelines Application Note
Can this component be reused after rework?
No, it is recommended that the component not be reused if rework becomes necessary due to high temperatures.
From: Fairchild MicroFET 1.6x1.6mm Assembly Guidelines Application Note
What is the recommended maximum voiding for MLP type packages?
Fairchild suggests a maximum of 25% voiding for MLP type packages based on reliability studies.
From: Fairchild Semiconductor AN-9747 Assembly Guidelines for MicroFET 1.6x1.6mm Dual Packaging
Can the MicroFET 1.6x1.6 Dual be reworked?
It is recommended that this component not be reused if rework becomes necessary due to high temperatures associated with lead-free reflow.
From: Fairchild Semiconductor AN-9747 Assembly Guidelines for MicroFET 1.6x1.6mm Dual Packaging