Key facts
- Brand
- Fairchild
- Model
- Power33
- Category
- Other Electronics
- Documents
- 2
- Languages
- EN
- Last added
- 2012-07-12
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Fairchild Semiconductor AN-9057 Assembly Guidelines for Asymmetric Dual Power33 Packaging
This document serves as an application note (AN-9057) detailing assembly guidelines for the Fairchild Dual Power33 package, which utilizes Molded Leadless Packaging (MLP) technology. The package integrates high- and low-side MOSFETs for high-current synchronous buck DC-DC circuits, offering low profile and excellent thermal performance through direct soldering to the printed wiring board (PWB).
Read onlineFairchild Power33 specifications
| Package Technology | Molded Leadless Packaging (MLP) |
|---|---|
| Peak Reflow Temperature | 260°C |
| Lead Finish | NiPdAu |
| Recommended PWB Material | lead free FR-4 |
| Recommended Solder Alloy | SAC 305 |
| Temperature Cycle Range | -40 to 125°C |
Source: Fairchild Semiconductor AN-9057 Assembly Guidelines for Asymmetric Dual Power33 Packaging
All Fairchild Power33 documents by type
How to use the product for one specific task, with worked examples.
Questions answered in these manuals
What is the recommended PWB material for the Dual Power33?
It is recommended that lead free FR-4 is used in PWB construction to handle lead-free reflow temperatures.
From: Fairchild Semiconductor AN-9057 Assembly Guidelines for Asymmetric Dual Power33 Packaging
Can vias be placed inside the thermal pads?
Yes, it is acceptable, but designers should carefully characterize the PWB and process designs with x-ray inspection to ensure there is not a voiding problem.
From: Fairchild Semiconductor AN-9057 Assembly Guidelines for Asymmetric Dual Power33 Packaging
What is the recommended solder paste alloy for the Power33?
The recommended lead-free solder paste alloy is SAC 305 (96.5 Sn/3.0Au/0.5Cu).
From: FAIRCHILD AN-9040 Assembly Guidelines for Power33 Packaging handbook
What is the maximum allowable voiding percentage for the Power33?
Fairchild recommends a guideline of 25% voiding for Power33 packages.
From: FAIRCHILD AN-9040 Assembly Guidelines for Power33 Packaging handbook