FAIRCHILD Assembly Guidelines for Asymmetric Dual Power33 Packaging handbook

Update: 30 September, 2023

This document describes the assembly guidelines for the Fairchild Dual Power33 package, which uses Molded Leadless Packaging (MLP) technology and has low package height and excellent thermal performance.

File format: PDF

Size: -

MD5 Checksum: 4CC98D8F20BCF1D87660FB5AE02AF061

Publication date: 12 July, 2012

Downloads: -

PDF Link: FAIRCHILD Assembly Guidelines for Asymmetric Dual Power33 Packaging handbook PDF

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