FAIRCHILD AN-9040 Assembly Guidelines for Power33 Packaging handbook

About this manual

This document serves as an application note detailing the assembly guidelines for the Fairchild Power33 package. It focuses on soldering and back-end processing to ensure reliable assembly and thermal performance. The text explains that the Power33 uses a flat leaded package designed to achieve SO-8 type performance in a form factor 70% smaller, utilizing a large thermal pad that solder directly to the printed wiring board (PWB).

What's inside

• Introduction
• Board Mounting
• PWB Design Considerations
• Pad Finish
• Using Vias with Power33
• Stencil Design
• Solder Paste
• Reflow Profile
• Voiding
• Rework

Specifications

Frequently asked questions

What is the recommended solder paste alloy for the Power33?

The recommended lead-free solder paste alloy is SAC 305 (96.5 Sn/3.0Au/0.5Cu).

What is the maximum allowable voiding percentage for the Power33?

Fairchild recommends a guideline of 25% voiding for Power33 packages.

Can the Power33 component be reused after rework?

No, it is recommended that the component not be reused if rework becomes necessary due to high temperatures.