Key facts
- Brand
- ROHM
- Model
- VCSP85H2
- Industry
- Industrial
- Documents
- 7
- Languages
- EN
- Last added
- 2012-06-04
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ROHM VCSP85H2 Package Design Support Document
This ROHM design support document provides detailed information about the VCSP85H2 semiconductor package, including its structure, materials, and recommended handling procedures. It covers tape‑and‑reel packaging, storage conditions, marking, and recommended soldering profiles.
The document also includes mechanical data such as footprint and external dimensions, guidance on underfill material usage, and safety notices. It is intended for engineers designing PCBs that use the VCSP85H2 package.
ROHM VCSP85H2 specifications
| Package type | VCSP85H2 |
|---|---|
| Dehydrated weight | 0.01 g |
| Recommended storage temperature | 5 ~ 30 °C |
| Recommended storage humidity | 40 ~ 70 % RH |
| Maximum reflow temperature | 260 °C |
| Cover tape peelback strength | 0.2 ~ 0.7 N |
All ROHM VCSP85H2 documents by type
Ratings, dimensions and ordering codes, for selection and design work.
- ROHM VCSP85H2 Package Design Support Document 5 p
- ROHM VCSP85H2 Design Support Document 5 p
- ROHM VCSP85H2 Package Design Support Document 5 p
- ROHM VCSP85H2 Package Design Support Document 5 p
- ROHM VCSP85H2 Design Support Document 5 p
- ROHM VCSP85H2 Design Support Document 5 p
- ROHM VCSP85H2 Design Support Document 5 p
Questions answered in these manuals
What are the recommended storage conditions for the VCSP85H2 package?
The package should be stored at 5 ~ 30 °C with 40 ~ 70 % relative humidity.
What is the peelback strength of the cover tape?
The cover tape peelback strength is specified as 0.2 ~ 0.7 N.
What are the recommended storage temperature and humidity for the VCSP85H2 package?
The recommended storage temperature is 5 °C to 30 °C and the humidity range is 40 % to 70 % RH.
How many components are packed per reel?
Each reel contains 3,000 components.
What is the cover tape peelback strength for the VCSP85H2 package?
The cover tape peelback strength is specified as 0.2 to 0.7 N.
What materials are used for the die and post of the VCSP85H2?
The die is made of silicon and the post is made of copper.