Key facts
- Brand
- ROHM
- Model
- SSOP6
- Category
- Other Electronics
- Documents
- 2
- Languages
- EN
- Last added
- 2012-06-04
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ROHM SOP4/SSOP5/SSOP6 Package Design Support Document
This design support document describes the structure, materials, and handling requirements for ROHM's SOP4, SSOP5, and SSOP6 surface‑mount packages. It includes detailed information on tape‑and‑reel packaging, storage conditions, marking, footprint dimensions, and recommended soldering processes.
Key sections cover package structure, tape and reel specifications, recommended storage temperature (5‑30 °C) and humidity (40‑70 % RH), a one‑year storage period, footprint dimensions (e.g., 0.65 mm pitch for SOP4), and soldering profiles for reflow, wave, and solder‑iron methods.
ROHM SSOP6 specifications
| Package types | SOP4, SSOP5, SSOP6 |
|---|---|
| Maximum storage period | 1 year |
| Reflow preheat temperature (max) | 260 °C |
| Reflow soldering temperature range | 220 °C to 230 °C |
| Solder‑iron temperature limit | ≤ 380 °C |
Source: ROHM SOP4/SSOP5/SSOP6 Package Design Support Document
All ROHM SSOP6 documents by type
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
Is the SSOP6 package suitable for radiation‑tolerant applications?
No, the products specified in this document are not designed to be radiation tolerant.
May I copy or reproduce this document?
No, copying or reproduction of the document, in part or in whole, is not permitted without ROHM's consent.