This document introduces design support information for VCSP85H2 (BD6092GU), including circuit diagrams, schematic diagrams, and application circuits.
The ROHM VCSP85H2 design support document provides detailed information on the package structure, materials, and handling requirements. It includes specifications such as footprint dimensions, tape and reel packaging, and recommended storage conditions.
Additional sections cover soldering profiles, peelback strength, and precautions for handling and underfill materials, helping designers integrate the component safely into electronic assemblies.
| Package type | VCSP85H2 |
|---|---|
| Die material | Silicon |
| Post material | Cu |
| Encapsulation material | Epoxy Resin |
| External terminal alloy | Sn-3Ag-0.5Cu |
| Marking method | Laser Marking |
| Dehydrated weight | 0.01 g |
| Cover tape peelback strength | 0.2~0.7 N |
| Recommended storage temperature | 5~30 °C |
| Recommended storage humidity | 40~70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Soldering temperature range | 220~230 °C |
The cover tape peelback strength is specified as 0.2 to 0.7 N.
The die is made of silicon and the post is made of copper.