This document introduces the function and features of ROHM's VCSP85H2 (BH6172GU) product, including system overview, pin allocation, package size, main parameters, and application suggestions.
This design support document provides detailed information about the ROHM VCSP85H2 (BH6172GU) semiconductor package. It covers package structure, materials, tape‑and‑reel packaging, storage conditions, marking, soldering profiles, footprint and external dimensions, and handling precautions.
The document is intended for engineers designing PCBs and for manufacturers handling the component. It includes recommended reflow temperature profiles, storage limits, and guidelines for underfill and handling to ensure reliable assembly and long‑term performance.
| Package type | VCSP85H2 |
|---|---|
| Die material | Silicon |
| External terminal material | Sn‑3Ag‑0.5Cu solder |
| Tape quantity per reel | 3,000 pcs/reel |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Reflow peak temperature | 260 °C max |
| Preheat temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
Each reel contains 3,000 pieces of the VCSP85H2 package.
The die is made of silicon.