Key facts
- Brand
- ROHM
- Model
- UCSP50L1
- Industry
- Industrial
- Documents
- 2
- Languages
- EN
- Last added
- 2012-06-04
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ROHM UCSP50L1 Package Design Support Document
This document describes the UCSP50L1 semiconductor package, covering its structure, materials, tape‑and‑reel packaging, storage guidelines, marking, soldering profiles, footprint and external dimensions, and handling precautions. It is intended to help designers integrate the component safely and reliably.
Key information includes recommended storage temperature and humidity, a detailed reflow soldering temperature profile, peelback strength of the cover tape, and packaging quantities. The document also notes that the package is not radiation tolerant and provides legal notices regarding use and export.
ROHM UCSP50L1 specifications
| Package type | UCSP50L1 |
|---|---|
| Dehydrated weight | 3.3 mg |
| Tape quantity per reel | 3,000 pcs |
| Storage temperature | 5 to 30 °C |
| Storage humidity | 40 to 70 % RH |
| Maximum storage period | 1 year |
| Preheat max temperature | 260 °C |
| Soldering temperature | 220 to 230 °C |
| Cover tape peelback strength | 0.2 to 0.7 N |
All ROHM UCSP50L1 documents by type
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What are the recommended storage conditions for the UCSP50L1 package?
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
What is the recommended reflow soldering temperature profile?
Preheat up to 260 °C max, with a preheat zone of 130 °C to 190 °C for up to 120 s, followed by a soldering zone of 220 °C to 230 °C for up to 60 s.
What are the recommended storage conditions for the UCSP50L1 package?
The package should be stored at 5 °C to 30 °C with 40 % to 70 % relative humidity.
How many units are typically packed per reel?
Each reel contains 3,000 pieces.