This document introduces the design support document for ROHM's VCSP85H2 (BD6062GU) product, including the features and characteristics of the product.
This ROHM design support document provides detailed information about the VCSP85H2 semiconductor package, including its structure, materials, and recommended handling procedures. It covers tape‑and‑reel packaging, storage conditions, marking, and recommended soldering profiles.
The document also includes mechanical data such as footprint and external dimensions, guidance on underfill material usage, and safety notices. It is intended for engineers designing PCBs that use the VCSP85H2 package.
| Package type | VCSP85H2 |
|---|---|
| Dehydrated weight | 0.01 g |
| Recommended storage temperature | 5 ~ 30 °C |
| Recommended storage humidity | 40 ~ 70 % RH |
| Maximum reflow temperature | 260 °C |
| Cover tape peelback strength | 0.2 ~ 0.7 N |
The package should be stored at 5 ~ 30 °C with 40 ~ 70 % relative humidity.
The cover tape peelback strength is specified as 0.2 ~ 0.7 N.
The specified storage period is one year.