Key facts
- Brand
- ROHM
- Model
- HTSSOP-C48
- Category
- Other Electronics
- Documents
- 2
- Languages
- EN
- Last added
- 2012-06-04
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ROHM HTSSOP-C48 Design Support Document
This design support document provides detailed information for the ROHM HTSSOP-C48 (and HTSSOP-C48R) semiconductor package. It covers package structure, tape‑and‑reel packaging, storage conditions, marking, footprint dimensions, and recommended soldering processes.
The document also includes mechanical drawings, tape and reel specifications, shipping guidelines, and safety notices, helping designers integrate the component into electronic assemblies with reliable performance.
ROHM HTSSOP-C48 specifications
| Recommended storage temperature | 5 to 30°C |
|---|---|
| Recommended storage humidity | 40 to 70% RH |
| Specified storage period | 1 year |
| Reflow preheating temperature | 130°C to 190°C |
| Reflow soldering temperature | 220°C to 230°C |
| Wave soldering temperature | 260°C + 3°C |
| Solder iron temperature limit | ≤ 380°C |
All ROHM HTSSOP-C48 documents by type
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What is the maximum solder iron temperature for HTSSOP-C48?
The solder iron temperature should not exceed 380 °C.
Can the HTSSOP-C48 package be used in radiation tolerant applications?
No, the products specified in this document are not designed to be radiation tolerant.
Is copying or reproducing this document allowed?
No, copying or reproduction of the document, in part or in whole, is not permitted without ROHM's consent.