Key facts
- Brand
- ROHM
- Model
- B54R
- Industry
- Industrial
- Documents
- 2
- Languages
- EN
- Last added
- 2012-06-04
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ROHM HTSSOP-B54/B54R Package Design Support Document
This design support document provides detailed information for the ROHM HTSSOP‑B54 and HTSSOP‑B54R semiconductor packages. It includes package structure, material composition, tape‑and‑reel specifications, labeling, packing, shipping, storage conditions, and recommended soldering processes.
Key specifications such as package dimensions, land pitch, storage temperature and humidity ranges, and soldering temperature profiles are listed to help designers integrate the component safely and reliably into their products.
ROHM B54R specifications
| Storage temperature | 5 °C to 30 °C |
|---|---|
| Storage humidity | 40 % to 70 % RH |
| Storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Solder iron temperature | ≤ 380 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
| Land pitch | 0.65 mm |
| Package length | 18.5 mm (max 18.85 mm) |
Source: ROHM HTSSOP-B54/B54R Package Design Support Document
All ROHM B54R documents by type
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What are the recommended storage temperature and humidity for the HTSSOP‑B54/B54R package?
The recommended storage temperature is 5 °C to 30 °C and the humidity range is 40 % to 70 % RH.
What is the maximum reflow soldering temperature?
The reflow profile allows a maximum temperature of 260 °C.
What are the recommended storage conditions for the HTSSOP‑B54/B54R package?
Store the packages at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
What is the maximum solder‑iron temperature for HTSSOP‑B54/B54R?
The solder‑iron temperature should not exceed 380 °C.