Key facts
- Brand
- ROHM
- Model
- TSSOP-B8
- Category
- Other Electronics
- Documents
- 2
- Languages
- EN
- Last added
- 2012-06-04
Start here
ROHM TSSOP-B8 Package Datasheet
This ROHM design support document describes the external TSSOP‑B8 package used for semiconductor components. It includes a brief package overview and notes that the package dimensions are not scaled in the images.
Legal notices and usage guidelines are provided, stating that the information is for reference only, may change without notice, and that the products are not radiation tolerant nor intended for safety‑critical applications such as medical or aerospace equipment.
All ROHM TSSOP-B8 documents by type
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What package type is described in this document?
The document describes the TSSOP‑B8 package.
Are the products in this document radiation tolerant?
No, the products are not designed to be radiation tolerant.
What package model does this document describe?
It describes the TSSOP‑B8J semiconductor package.
Is the TSSOP‑B8J package designed for radiation‑tolerant applications?
No, the products specified in this document are not designed to be radiation tolerant.