This Design Support Document introduces the VDC power chip VCSP85H2 (BD6066GU) and provides common circuit application examples.
This design support document provides detailed information for the ROHM VCSP85H2 (BD6066GU) semiconductor package. It includes the package structure, material composition, tape‑and‑reel packaging specifications, storage conditions, marking conventions, recommended soldering profiles, and mechanical dimensions.
The document also gives guidance on underfill material usage, external dimensions, and peel‑back strength testing. It is intended for engineers designing PCBs that incorporate the VCSP85H2 package and need reliable data for assembly and reliability planning.
| Die material | Silicon |
|---|---|
| Lead material | Cu |
| Encapsulation material | Epoxy Resin |
| Terminal solder alloy | Sn‑3Ag‑0.5Cu |
| Storage temperature | 5~30 °C |
| Storage humidity | 40~70 % RH |
| Maximum reflow temperature | 260 °C |
| Reflow preheat temperature range | 130~190 °C |
| Soldering zone temperature range | 220~230 °C |
| Cover tape peel‑back strength | 0.2~0.7 N |
| Components per reel | 3,000 pcs |
The recommended storage temperature is 5 °C to 30 °C and the humidity range is 40 % to 70 % RH.
Each reel contains 3,000 components.