Key facts
- Brand
- ROHM
- Model
- HSON8
- Industry
- Industrial
- Documents
- 2
- Languages
- EN
- Last added
- 2012-06-04
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ROHM VSOF5/HVSOF5/HVSOF6/HSON8 Package Design Support Document
The document describes the structure, materials, and mechanical dimensions of the VSOF5, HVSOF5, HVSOF6, and HSON8 semiconductor packages. It includes detailed tape‑and‑reel packaging data, marking information, and recommended storage and handling conditions.
Additional sections cover footprint dimensions, recommended reflow soldering temperature profiles, and packaging/shipping styles to help designers integrate these components into their products safely and reliably.
ROHM HSON8 specifications
| Storage temperature | 15 to 30 °C |
|---|---|
| Storage humidity | 40 to 70 % RH |
| Storage period | 1 year |
| Preheating temperature (reflow) | 130 °C to 190 °C |
| Soldering temperature (reflow) | 220 °C to 230 °C |
| VSOF5 tape dimensions | Width 1.83 mm, Length 61.5 mm |
| VSOF5 package dimension | 1.6 mm ±0.05 mm |
| HSON8 package dimension | 2.9 mm ±0.1 mm |
Source: ROHM VSOF5/HVSOF5/HVSOF6/HSON8 Package Design Support Document
All ROHM HSON8 documents by type
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What temperature range should the packages be stored at?
The recommended storage temperature is 15 to 30 °C.
From: ROHM VSOF5/HVSOF5/HVSOF6/HSON8 Package Design Support Document
What humidity range is recommended for storage?
Store the packages at 40 to 70 % relative humidity.
From: ROHM VSOF5/HVSOF5/HVSOF6/HSON8 Package Design Support Document
Is the HSON8 package designed for radiation‑tolerant applications?
No, the products specified in this document are not designed to be radiation tolerant.
May the document be copied or reproduced without permission?
No, copying or reproduction of any part of the document is not permitted without ROHM's consent.