Key facts
- Brand
- ROHM
- Model
- 5050 series
- Category
- Other Electronics
- Documents
- 2
- Languages
- EN
- Last added
- 2012-06-04
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ROHM UQFNxxxV3030/4040/5050 Series Design Support Document
This document provides technical information for ROHM's UQFNxxxV3030/4040/5050 series semiconductor packages. It describes the package structure, materials, tape‑and‑reel packaging, storage conditions, marking, footprint dimensions, and recommended soldering procedures.
The guide also includes packaging specifications, peelback strength, recommended reflow temperature profile, and handling notes such as the prohibition of wave soldering and rework with a soldering iron. It is intended for designers and manufacturers integrating these components into electronic equipment.
ROHM 5050 series specifications
| Package series | UQFNxxxV3030/4040/5050 |
|---|---|
| Storage temperature range | 5 °C – 30 °C |
| Storage humidity range | 40 % – 70 % RH |
| Specified storage period | 1 year |
| Cover tape peelback strength | 0.2 N – 0.7 N |
| Maximum reflow passes | 2 |
| Preheat ramp rate | 1 °C – 4 °C/sec |
| Footprint land pitch (UQFN036V5050 example) | 0.40 mm |
| Footprint length (UQFN036V5050 example) | 3.60 mm |
Source: ROHM UQFNxxxV3030/4040/5050 Series Design Support Document
All ROHM 5050 series documents by type
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
Is wave soldering supported for this package?
No, the wave soldering method is not supported for the UQFNxxxV series.
From: ROHM UQFNxxxV3030/4040/5050 Series Design Support Document
What is the cover tape peelback strength?
The cover tape has a peelback strength of 0.2 N to 0.7 N.
From: ROHM UQFNxxxV3030/4040/5050 Series Design Support Document
What are the recommended storage conditions for the VQFN series?
Store the packages at 5 °C to 30 °C with 40 % to 70 % relative humidity, and keep them for up to one year.
From: ROHM VQFNxxxV3030/4040/5050 Series Design Support Document
What soldering temperature profile is recommended?
Use a preheating temperature of 130 °C to 190 °C, followed by a soldering temperature of 220 °C to 230 °C.
From: ROHM VQFNxxxV3030/4040/5050 Series Design Support Document