This document describes the structure, materials, and dimensions of the ROHM VCSP85H2 (BH6172GU) semiconductor package. It includes detailed information on tape and reel packaging, storage conditions, marking, and handling precautions.
Key sections cover recommended soldering temperature profiles, storage environment specifications, footprint and external dimensions, as well as packaging and shipping guidelines. The document is intended for designers and manufacturers integrating the VCSP85H2 into electronic equipment.
| Dehydrated weight | 0.01 g |
|---|---|
| Recommended storage temperature | 5 to 30°C |
| Recommended storage humidity | 40 to 70% RH |
| Specified storage period | 1 year |
| Soldering temperature range | 220°C to 230°C |
| Preheating temperature range | 130°C to 190°C |
| Maximum reflow temperature | 260°C |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Cover tape peelback speed | 165 to 180°/mm/min |
| Tape and reel quantity | 3,000 pcs per reel |
The recommended storage temperature is 5 °C to 30 °C and humidity is 40 % to 70 % RH.
The recommended soldering temperature range is 220 °C to 230 °C.
No, the wave soldering method is not supported for this package.
Each reel contains 3,000 pieces of the VCSP85H2 package.