Key facts
- Brand
- ROHM
- Model
- VCSP35L1
- Industry
- Industrial
- Documents
- 2
- Languages
- EN
- Last added
- 2012-06-04
Start here
ROHM VCSP35L1 Semiconductor Package Design Support Document
The ROHM VCSP35L1 Design Support Document provides detailed information on the package structure, materials, and dimensions. It includes guidelines for tape and reel packaging, storage conditions, marking, soldering profiles, and handling precautions.
The document also outlines recommended storage temperature (5‑30 °C) and humidity (40‑70 % RH), reflow temperature limits, and peelback strength for the cover tape. It is intended for engineers designing PCBs that use this component.
ROHM VCSP35L1 specifications
| Package | VCSP35L1 |
|---|---|
| Die Material | Silicon |
| Lead Material | Sn‑3Ag‑0.5Cu solder |
| Mold Compound | Polyamide‑imide Resin |
| Recommended Storage Temperature | 5 to 30 °C |
| Recommended Storage Humidity | 40 to 70 % RH |
| Maximum Storage Period | 1 year |
| Reflow Preheat Temperature | 130 °C to 190 °C |
| Reflow Soldering Temperature | 220 °C to 230 °C |
| Tape Reel Quantity | 3,000 pcs per reel |
| Cover Tape Peelback Strength | 0.2 to 0.7 N |
Source: ROHM VCSP35L1 Semiconductor Package Design Support Document
All ROHM VCSP35L1 documents by type
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What are the recommended storage temperature and humidity for the VCSP35L1 package?
The recommended storage temperature is 5 °C to 30 °C and the humidity should be 40 % to 70 % RH.
From: ROHM VCSP35L1 Semiconductor Package Design Support Document
What is the recommended reflow temperature profile for the VCSP35L1?
Preheat to 130 °C‑190 °C, with a maximum overall temperature of 260 °C, and soldering at 220 °C‑230 °C.
From: ROHM VCSP35L1 Semiconductor Package Design Support Document
What are the recommended storage conditions for the UCSP35L1 package?
Store the package at temperatures between 5 °C and 30 °C with 40 % to 70 % relative humidity for up to one year.
From: ROHM VCSP35L1 handbook
What soldering temperature range should be used for the UCSP35L1?
The recommended reflow soldering temperature is 220 °C to 230 °C.
From: ROHM VCSP35L1 handbook