This document introduces ROHM's VCSP85H2(BH76061GU) product, including its design support documents and contact information. The product features improved specifications and application examples.
This document describes the VCSP85H2 semiconductor package, including its structure, materials, and recommended handling. It covers tape‑and‑reel packaging, storage conditions, marking information, and soldering guidelines.
Additional sections detail footprint dimensions, underfill material considerations, external dimensions, and packaging styles, along with legal notices and contact information for ROHM support.
| Package | VCSP85H2 |
|---|---|
| Die material | Silicon |
| External terminal solder | Sn‑3Ag‑0.5Cu |
| Storage temperature range | 5–30 °C |
| Storage humidity range | 40–70 % RH |
| Specified storage period | 1 year |
| Soldering temperature range | 220–230 °C |
| Preheating temperature range | 130–190 °C |
| Cover tape peelback strength | 0.2–0.7 N |
| Quantity per reel | 3,000 pcs |
Each reel can hold up to 3,000 pieces of the VCSP85H2 package.
The cover tape peelback strength is specified as 0.2 N to 0.7 N.