Key facts
- Brand
- ROHM
- Model
- HSOP25
- Category
- Other Electronics
- Documents
- 2
- Languages
- EN
- Last added
- 2012-06-04
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ROHM HSOP25Z Design Support Document
Datasheet 6 pages · 768 KB · EN
This document describes the HSOP25Z semiconductor package, including its structure, materials, and detailed mechanical dimensions. It also lists tape‑and‑reel packaging specifications, labeling, and shipping information.
Additional sections cover recommended storage environment, marking lot numbers, and soldering conditions for both reflow and wave soldering, as well as recommended solder‑iron settings. The information is intended for designers integrating the part into electronic equipment.
ROHM HSOP25 specifications
| Package | HSOP25Z |
|---|---|
| Recommended storage temperature | 5~30°C |
| Recommended storage humidity | 40~70% RH |
| Storage period | 1 year |
| Land pitch | 0.80 mm |
| Reflow preheating temperature | 130°C~190°C |
| Reflow soldering temperature | 220°C~230°C |
| Maximum solder‑iron temperature | ≤380°C |
All ROHM HSOP25 documents by type
Datasheet 1
Ratings, dimensions and ordering codes, for selection and design work.
Product Leaflet 1
Questions answered in these manuals
What is the land pitch of the HSOP25Z footprint?
The land pitch is 0.80 mm.
What is the package type described in this document?
The document describes the HSOP25 semiconductor package.
Which software version is required to view the document correctly?
A 3D‑enabled browser and Adobe Reader 8.0 or later are required.