Key facts
- Brand
- ROHM
- Model
- VCSP85H3
- Industry
- Industrial
- Documents
- 4
- Languages
- EN
- Last added
- 2012-06-04
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ROHM VCSP85H3 Design Support Document
This design support document from ROHM describes the VCSP85H3 (BD2812GU) semiconductor package. It covers the package structure, materials, tape‑and‑reel packaging, storage conditions, marking, soldering profiles, footprint and external dimensions, and handling precautions.
Key sections include detailed dimensions, recommended reflow temperature profiles, peel‑back strength of the cover tape, and packaging quantities. The document also contains legal notices and contact information for further technical support.
ROHM VCSP85H3 specifications
| Package type | VCSP85H3 (BD2812GU) |
|---|---|
| Dehydrated weight | 0.02 g |
| Recommended storage temperature | 5 to 30 °C |
| Recommended storage humidity | 40 to 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Cover tape peelback speed | 165 to 180° 300+10 mm/min |
| Quantity per reel | 2,500 pcs |
All ROHM VCSP85H3 documents by type
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What is the cover tape peelback strength for the VCSP85H3 package?
The cover tape peelback strength is specified as 0.2 to 0.7 N.
How many components are packed per reel for VCSP85H3?
Each reel contains 2,500 pieces of the VCSP85H3 package.
What is the package type of the VCSP85H3?
The package is identified as VCSP85H3 (BD6081 GU).
What are the recommended storage conditions for the VCSP85H3 package?
Store the package at 5~30 °C with 40~70 % relative humidity for up to one year.
What is the maximum reflow temperature allowed for VCSP85H3?
The maximum reflow temperature is 260 °C.
How many units are packed per reel for VCSP85H3?
Each reel contains 2,500 pieces of the VCSP85H3 package.