This Design Support Document details the characteristics and application circuits of the VDC/DC converter VCSP85H3 (BD6081GU)
This design support document describes the VCSP85H3 semiconductor package, including its internal structure, material composition, and recommended handling procedures. It contains detailed information on tape‑and‑reel packaging, storage conditions, marking, soldering profiles, footprint dimensions, underfill considerations, and external dimensions.
Key sections cover the package materials (silicon die, copper layers, epoxy resin, Sn‑3Ag‑0.5Cu solder), recommended storage temperature (5~30 °C) and humidity (40~70 % RH), soldering temperature profile (preheat up to 260 °C, soldering zone 220‑230 °C), and mechanical specifications such as dehydrated weight (0.03 g) and peelback strength (0.2~0.7 N).
| Dehydrated weight | 0.03 g |
|---|---|
| Recommended storage temperature | 5~30 °C |
| Recommended storage humidity | 40~70 % RH |
| Specified storage period | 1 year |
| Preheat temperature (max) | 260 °C |
| Soldering temperature range | 220~230 °C |
| Cover tape peelback strength | 0.2~0.7 N |
The package is identified as VCSP85H3 (BD6081 GU).
Store the package at 5~30 °C with 40~70 % relative humidity for up to one year.
Preheat up to a maximum of 260 °C, then use a soldering zone temperature of 220‑230 °C.
The dehydrated weight is 0.03 g.