This document describes the features and characteristics of the VCSP85H3 (BD60910GU) product produced by ROHM.
This ROHM design support document provides detailed information for the VCSP85H3 (BD2812GU) semiconductor package. It includes the package structure and materials, tape‑and‑reel packaging specifications, storage and handling requirements, recommended soldering profiles, and dimensional data for PCB footprint and external size.
Key sections cover storage conditions (5‑30 °C, 40‑70 % RH, 1‑year shelf life), reflow soldering limits (up to 260 °C, preheat 130‑190 °C, soldering 220‑230 °C), tape‑and‑reel quantities (2,500 pcs/reel), and precautions for handling the silicon substrate and underfill materials.
| Dehydrated weight | 0.02 g |
|---|---|
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
| Cover tape peelback speed | 165°‑180° at 300 mm/min |
| Tape and reel quantity | 2,500 pcs per reel |
The maximum reflow temperature is 260 °C.
Each reel contains 2,500 pieces of the VCSP85H3 package.
The cover tape peelback strength should be between 0.2 N and 0.7 N.