The VCSP85H3 semiconductor package is described with its internal structure, materials (silicon die, copper layers, epoxy resin, Sn‑3Ag‑0.5Cu solder) and a dehydrated weight of 0.03 g. The document lists the recommended tape‑and‑reel packaging, labeling, and shipping specifications for efficient handling.
Key technical guidance includes storage conditions (5‑30 °C, 40‑70 % RH, up to 1 year), recommended reflow soldering profile (preheat 130‑190 °C, peak 260 °C max, solder zone 220‑230 °C), footprint dimensions, and notes on underfill material and external dimensions. Wave soldering and manual solder‑iron heating are not supported.
| Dehydrated weight | 0.03 g |
|---|---|
| Storage temperature | 5~30 °C |
| Storage humidity | 40~70 % RH |
| Maximum storage period | 1 year |
| Reflow peak temperature | 260 °C max |
| Preheat temperature range | 130~190 °C |
| Soldering temperature range | 220~230 °C |
| Cover tape peelback strength | 0.2~0.7 N |
| Pad size (footprint) | 0.25 mm |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
Use a preheat of 130 °C–190 °C, a peak temperature not exceeding 260 °C, and a soldering zone of 220 °C–230 °C.
No, the wave soldering method is not supported.
Each reel holds 2,500 pieces of the VCSP85H3 package.