This design support document describes the design information of VCSP85H3 (BD2812GU), including product specifications, package form, pin configuration, characteristics table, application circuit, etc.
This design support document from ROHM describes the VCSP85H3 (BD2812GU) semiconductor package. It covers the package structure, materials, tape‑and‑reel packaging, storage conditions, marking, soldering profiles, footprint and external dimensions, and handling precautions.
Key sections include detailed dimensions, recommended reflow temperature profiles, peel‑back strength of the cover tape, and packaging quantities. The document also contains legal notices and contact information for further technical support.
| Package type | VCSP85H3 (BD2812GU) |
|---|---|
| Dehydrated weight | 0.02 g |
| Recommended storage temperature | 5 to 30 °C |
| Recommended storage humidity | 40 to 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
| Cover tape peelback strength | 0.2 to 0.7 N |
| Cover tape peelback speed | 165 to 180° 300+10 mm/min |
| Quantity per reel | 2,500 pcs |
The cover tape peelback strength is specified as 0.2 to 0.7 N.
Each reel contains 2,500 pieces of the VCSP85H3 package.