This document provides design support information for ROHM's VCSP35L1 (BU9006GUZ) product, including its features and characteristics.
The ROHM VCSP35L1 Design Support Document provides detailed information on the package structure, materials, and dimensions. It includes guidelines for tape and reel packaging, storage conditions, marking, soldering profiles, and handling precautions.
The document also outlines recommended storage temperature (5‑30 °C) and humidity (40‑70 % RH), reflow temperature limits, and peelback strength for the cover tape. It is intended for engineers designing PCBs that use this component.
| Package | VCSP35L1 |
|---|---|
| Die Material | Silicon |
| Lead Material | Sn‑3Ag‑0.5Cu solder |
| Mold Compound | Polyamide‑imide Resin |
| Recommended Storage Temperature | 5 to 30 °C |
| Recommended Storage Humidity | 40 to 70 % RH |
| Maximum Storage Period | 1 year |
| Reflow Preheat Temperature | 130 °C to 190 °C |
| Reflow Soldering Temperature | 220 °C to 230 °C |
| Tape Reel Quantity | 3,000 pcs per reel |
| Cover Tape Peelback Strength | 0.2 to 0.7 N |
The recommended storage temperature is 5 °C to 30 °C and the humidity should be 40 % to 70 % RH.
Preheat to 130 °C‑190 °C, with a maximum overall temperature of 260 °C, and soldering at 220 °C‑230 °C.
Each reel contains 3,000 pieces of the VCSP35L1 package.