This is a design support document for BU52054GWZ, which details the features and usage of the device
This document describes the UCSP35L1 semiconductor package, covering its structure, materials, and recommended handling. It includes detailed tape‑and‑reel packaging information, storage conditions, and soldering profiles.
Key sections provide footprint and external dimensions, marking lot number guidelines, precautions for handling, and test methods such as peelback strength. The document is intended for designers and manufacturers integrating the UCSP35L1 into electronic assemblies.
| Package type | UCSP35L1 |
|---|---|
| Die material | Silicon |
| External terminal solder | Sn‑3Ag‑0.5Cu |
| Mold compound | Polyamide‑imide Resin |
| Dehydrated weight | 0.43 mg |
| Storage temperature range | 5 °C to 30 °C |
| Storage humidity range | 40 % to 70 % RH |
| Recommended soldering temperature | 220 °C to 230 °C |
| Pre‑heat temperature range | 130 °C to 190 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
Store the package at temperatures between 5 °C and 30 °C with 40 % to 70 % relative humidity for up to one year.
The recommended reflow soldering temperature is 220 °C to 230 °C.
Each reel contains 3,000 pieces of the UCSP35L1 package.
The cover tape peelback strength is specified as 0.2 N to 0.7 N.