This document describes the UCSP50L1 semiconductor package, covering its structure, materials, tape‑and‑reel packaging, storage guidelines, marking, soldering profiles, footprint and external dimensions, and handling precautions. It is intended to help designers integrate the component safely and reliably.
Key information includes recommended storage temperature and humidity, a detailed reflow soldering temperature profile, peelback strength of the cover tape, and packaging quantities. The document also notes that the package is not radiation tolerant and provides legal notices regarding use and export.
| Package type | UCSP50L1 |
|---|---|
| Dehydrated weight | 3.3 mg |
| Tape quantity per reel | 3,000 pcs |
| Storage temperature | 5 to 30 °C |
| Storage humidity | 40 to 70 % RH |
| Maximum storage period | 1 year |
| Preheat max temperature | 260 °C |
| Soldering temperature | 220 to 230 °C |
| Cover tape peelback strength | 0.2 to 0.7 N |
Store the package at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
Preheat up to 260 °C max, with a preheat zone of 130 °C to 190 °C for up to 120 s, followed by a soldering zone of 220 °C to 230 °C for up to 60 s.
Each reel contains 3,000 pieces, and the tape dimensions are listed in the document (e.g., 2.20 mm × 2.20 mm).