This document introduces the UCSP50L1 (BD1204GWL) product from ROHM, including its features and characteristics.
This document provides detailed information on the ROHM UCSP50L1 package, including its structure, materials, and marking. It also describes tape‑and‑reel packaging specifications, storage conditions, and recommended soldering profiles.
Additional sections cover footprint and external dimensions, handling precautions, and guidelines for underfill materials. The document ends with legal notices and contact information for ROHM support.
| Package | UCSP50L1 |
|---|---|
| Dehydrated weight | 3.3 mg |
| Storage temperature | 5 to 30°C |
| Storage humidity | 40 to 70% RH |
| Recommended storage period | 1 year |
| Reflow preheating temperature | 130°C to 190°C |
| Reflow soldering temperature | 220°C to 230°C |
| Peelback strength | 0.2 to 0.7 N |
| Peelback speed | 165 to 180 mm/min |
The package should be stored at 5 °C to 30 °C with 40 % to 70 % relative humidity.
Each reel contains 3,000 pieces.
Avoid touching the side of the package to prevent chip damage or cracking.