Design support document of VQFNxxxV3030/4040/5050 series products, introduces package dimensions, pin definition, electrical performance and other information
This design support document provides detailed information on the VQFNxxxV3030/4040/5050 series semiconductor packages from ROHM. It includes package structure, material composition, tape‑and‑reel packaging, storage conditions, marking codes, footprint dimensions and recommended soldering profiles.
Key sections cover recommended storage temperature and humidity, storage period, peelback strength of cover tape, reflow temperature ranges, and packaging dimensions for tape, reel and shipping boxes. The document is intended for designers and manufacturers integrating these packages into electronic equipment.
| Package type | VQFNxxxV3030/4040/5050 series |
|---|---|
| Lead frame material | Cu alloy |
| Die material | Silicon |
| Die attach material | Ag Paste |
| Wire material | Cu |
| Molding material | Epoxy Resin |
| Recommended storage temperature | 5~30°C |
| Recommended storage humidity | 40~70% RH |
| Specified storage period | 1 year |
| Cover tape peelback strength | 0.2~0.7 N |
| Peelback angle | 165~180° |
| Preheating temperature | 130°C to 190°C |
| Soldering temperature | 220°C to 230°C |
| Maximum units per shipping box | 5 unit boxes or less |
Store the packages at 5 °C to 30 °C with 40 % to 70 % relative humidity, and keep them for up to one year.
Use a preheating temperature of 130 °C to 190 °C, followed by a soldering temperature of 220 °C to 230 °C.
The cover tape peelback strength is specified as 0.2 N to 0.7 N.
No more than five unit boxes should be placed in a single shipping box.