This document is a design support document for UQFNxxxV3030/4040/5050 series, which provides information on product package dimensions, pin layout, etc.
This document provides technical information for ROHM's UQFNxxxV3030/4040/5050 series semiconductor packages. It describes the package structure, materials, tape‑and‑reel packaging, storage conditions, marking, footprint dimensions, and recommended soldering procedures.
The guide also includes packaging specifications, peelback strength, recommended reflow temperature profile, and handling notes such as the prohibition of wave soldering and rework with a soldering iron. It is intended for designers and manufacturers integrating these components into electronic equipment.
| Package series | UQFNxxxV3030/4040/5050 |
|---|---|
| Storage temperature range | 5 °C – 30 °C |
| Storage humidity range | 40 % – 70 % RH |
| Specified storage period | 1 year |
| Cover tape peelback strength | 0.2 N – 0.7 N |
| Maximum reflow passes | 2 |
| Preheat ramp rate | 1 °C – 4 °C/sec |
| Footprint land pitch (UQFN036V5050 example) | 0.40 mm |
| Footprint length (UQFN036V5050 example) | 3.60 mm |
No, the wave soldering method is not supported for the UQFNxxxV series.
The cover tape has a peelback strength of 0.2 N to 0.7 N.