This is a design support document that introduces ROHM TSSOP-B8 package.
This ROHM design support document describes the external TSSOP‑B8 package used for semiconductor components. It includes a brief package overview and notes that the package dimensions are not scaled in the images.
Legal notices and usage guidelines are provided, stating that the information is for reference only, may change without notice, and that the products are not radiation tolerant nor intended for safety‑critical applications such as medical or aerospace equipment.
| Package type | TSSOP-B8 |
|---|
The document describes the TSSOP‑B8 package.
No, the products are not designed to be radiation tolerant.