This is a design support document for the HSOP25 package of R1010A
This ROHM design support document describes the HSOP25 semiconductor package, including package identification and recommended viewing conditions. It notes that the external package dimensions are shown and that internal structure data can be requested from ROHM.
The document also contains legal notices, usage warnings, and guidance on appropriate applications, emphasizing that the parts are not intended for radiation‑tolerant or safety‑critical systems. Contact information for further product details is provided.
| Package | HSOP25 |
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The document describes the HSOP25 semiconductor package.
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