This document is a design support document for HSOP25Z (a package).
This document describes the HSOP25Z semiconductor package, including its structure, materials, and detailed mechanical dimensions. It also lists tape‑and‑reel packaging specifications, labeling, and shipping information.
Additional sections cover recommended storage environment, marking lot numbers, and soldering conditions for both reflow and wave soldering, as well as recommended solder‑iron settings. The information is intended for designers integrating the part into electronic equipment.
| Package | HSOP25Z |
|---|---|
| Recommended storage temperature | 5~30°C |
| Recommended storage humidity | 40~70% RH |
| Storage period | 1 year |
| Land pitch | 0.80 mm |
| Reflow preheating temperature | 130°C~190°C |
| Reflow soldering temperature | 220°C~230°C |
| Maximum solder‑iron temperature | ≤380°C |
The land pitch is 0.80 mm.