ROHM VSOF5/HVSOF5/HVSOF6/HSON8 Package Design Support Document

Introduces the package dimensions of VSOF5, HVSOF5, HVSOF6, HSON8 and other 4 kinds of packages

Brand: ROHM
Category: Other Electronics
Document type: Product Leaflet
Language: English
Pages: 9
File format: PDF
File size: 908 KB
Published: 04 June, 2012
Updated: 30 September, 2023
Models: HSON8, HVSOF5, HVSOF6, VSOF5
MD5 checksum: D41524568B1B6E6C501C6E8646F69358
PDF: ROHM VSOF5/HVSOF5/HVSOF6/HSON8 Package Design Support Document PDF

About this manual

The document describes the structure, materials, and mechanical dimensions of the VSOF5, HVSOF5, HVSOF6, and HSON8 semiconductor packages. It includes detailed tape‑and‑reel packaging data, marking information, and recommended storage and handling conditions.

Additional sections cover footprint dimensions, recommended reflow soldering temperature profiles, and packaging/shipping styles to help designers integrate these components into their products safely and reliably.

What's inside

Structure and materials
Tape and Reel information
Storage conditions
Marking lot number
Footprint dimensions
Soldering conditions
Packing style
Shipping style
Package dimensions

Specifications

Storage temperature	15 to 30 °C
Storage humidity	40 to 70 % RH
Storage period	1 year
Preheating temperature (reflow)	130 °C to 190 °C
Soldering temperature (reflow)	220 °C to 230 °C
VSOF5 tape dimensions	Width 1.83 mm, Length 61.5 mm
VSOF5 package dimension	1.6 mm ±0.05 mm
HSON8 package dimension	2.9 mm ±0.1 mm

Frequently asked questions

What temperature range should the packages be stored at?

The recommended storage temperature is 15 to 30 °C.

What humidity range is recommended for storage?

Store the packages at 40 to 70 % relative humidity.

What are the recommended reflow soldering temperatures?

Preheat to 130‑190 °C and then solder at 220‑230 °C.

What are the tape dimensions for the VSOF5 package?

The VSOF5 tape is 1.83 mm wide and 61.5 mm long.

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