This design support document introduces ROHM's HSON package, including dimensions, materials, and other external information. It does not contain information on the internal structure.
This design support document from ROHM describes the HSON8 semiconductor package, including its external material composition and recommended viewing conditions. It is intended to help designers understand the typical functions and example application circuits for the package.
The document includes legal notices, copying restrictions, and safety recommendations. ROHM states that the package is not radiation‑tolerant and should not be used in safety‑critical equipment without prior consultation.
| Package type | HSON8 |
|---|
No, the products specified in this document are not designed to be radiation tolerant.
No, copying or reproduction of any part of the document is not permitted without ROHM's consent.