This datasheet provides the dimensions information for HTSSOP-B54/B54R, including package dimensions, lead dimensions etc.
This design support document from ROHM details the HTSSOP‑B54 and HTSSOP‑B54R semiconductor packages. It includes material composition, tape‑and‑reel packaging specifications, labeling, and shipping instructions.
The file also lists storage environment limits, recommended reflow and wave soldering profiles, solder‑iron settings, and mechanical dimensions such as land pitch, footprint, and package size. All data are intended for engineers designing PCB layouts and assembly processes.
| Package dimensions (L × W × H) | 18.5 mm × 6.0 mm × 0.8 mm (approx.) |
|---|---|
| Land pitch | 0.65 mm |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Reflow preheat temperature (max) | 260 °C |
| Solder‑iron temperature limit | ≤ 380 °C |
| Cover‑tape peelback strength | 0.2 N to 0.7 N |
Store the packages at 5 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
The solder‑iron temperature should not exceed 380 °C.