This document is a design support document for HTSSOP-B54 and HTSSOP-B54R. It contains product dimensions, pin positions, reference designs and other information.
This design support document provides detailed information for the ROHM HTSSOP‑B54 and HTSSOP‑B54R semiconductor packages. It includes package structure, material composition, tape‑and‑reel specifications, labeling, packing, shipping, storage conditions, and recommended soldering processes.
Key specifications such as package dimensions, land pitch, storage temperature and humidity ranges, and soldering temperature profiles are listed to help designers integrate the component safely and reliably into their products.
| Storage temperature | 5 °C to 30 °C |
|---|---|
| Storage humidity | 40 % to 70 % RH |
| Storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Solder iron temperature | ≤ 380 °C |
| Cover tape peelback strength | 0.2 N to 0.7 N |
| Land pitch | 0.65 mm |
| Package length | 18.5 mm (max 18.85 mm) |
The recommended storage temperature is 5 °C to 30 °C and the humidity range is 40 % to 70 % RH.
The reflow profile allows a maximum temperature of 260 °C.
Use a solder iron temperature of 380 °C or less.
Cover tape peelback strength is specified as 0.2 N to 0.7 N.