Key facts
- Brand
- Mitsubishi
- Model
- RA30H4047M
- Category
- Power Amplifier
- Industry
- Electronics
- Documents
- 2
- Languages
- EN
- Last added
- 2012-03-21
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Mitsubishi Electric RA30H4047M RF Power Module Datasheet
The RA30H4047M is a 30‑watt RF MOSFET amplifier module for 12.5‑V mobile radios operating in the 400‑470 MHz band. It uses enhancement‑mode MOSFET transistors, offers low‑power gate control (≈1 mA at 5 V) and can be used for both non‑linear FM and linear AM modulation by adjusting gate voltage and input power.
The document details recommended mounting, thermal design, and safety precautions. A flat heat‑sink surface (< 50 µm) and appropriate thermal compound are required, and the module is sensitive to ESD down to 1000 V. Proper soldering temperatures (< 350 °C) and solvent avoidance are also specified.
Mitsubishi RA30H4047M specifications
| Frequency Range | 400‑470 MHz |
|---|---|
| Output Power | 30 W |
| Total Efficiency | 40 % |
| Gate Current (IGG) | 1 mA (typical at 5 V) |
| Input Power (Pin) | 50 mW |
| Module Size | 66 × 21 × 9.88 mm |
| Recommended Heat‑Sink Flatness | < 50 µm |
| ESD Sensitivity | down to 1000 V |
Source: Mitsubishi Electric RA30H4047M RF Power Module Datasheet
All Mitsubishi RA30H4047M documents by type
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What gate voltage is needed for nominal output power?
Around 4.5 V (typical) to 5 V (maximum) the nominal output power becomes available.
From: Mitsubishi Electric RA30H4047M RF Power Module Datasheet
What is the recommended flatness for the heat sink when mounting the module?
The heat‑sink flatness should be less than 50 µm to avoid cracking the ceramic substrate.
From: Mitsubishi Electric RA30H4047M RF Power Module Datasheet
What torque should be used for the mounting screws?
M3 screws are recommended with a tightening torque of 4.0 to 6.0 kgf‑cm.
From: Mitsubishi Electric RA30H4047M1 RF Power Module Datasheet
How should the leads be soldered to avoid damage?
Solder the leads after the module is screwed to the heat sink, keeping the solder temperature below 350 °C and the soldering time under 3 seconds.
From: Mitsubishi Electric RA30H4047M1 RF Power Module Datasheet