This design support document introduces the dimension information of ROHM series products in SOP4, SSOP5, and SSOP6 packages.
This design support document describes the structure, materials, and handling requirements for ROHM's SOP4, SSOP5, and SSOP6 surface‑mount packages. It includes detailed information on tape‑and‑reel packaging, storage conditions, marking, footprint dimensions, and recommended soldering processes.
Key sections cover package structure, tape and reel specifications, recommended storage temperature (5‑30 °C) and humidity (40‑70 % RH), a one‑year storage period, footprint dimensions (e.g., 0.65 mm pitch for SOP4), and soldering profiles for reflow, wave, and solder‑iron methods.
| Package types | SOP4, SSOP5, SSOP6 |
|---|---|
| Maximum storage period | 1 year |
| Reflow preheat temperature (max) | 260 °C |
| Reflow soldering temperature range | 220 °C to 230 °C |
| Solder‑iron temperature limit | ≤ 380 °C |