This design support document provides detailed information for the ROHM HTSSOP-C48 (and HTSSOP-C48R) semiconductor package. It covers package structure, tape‑and‑reel packaging, storage conditions, marking, footprint dimensions, and recommended soldering processes.
The document also includes mechanical drawings, tape and reel specifications, shipping guidelines, and safety notices, helping designers integrate the component into electronic assemblies with reliable performance.
| Recommended storage temperature | 5 to 30°C |
|---|---|
| Recommended storage humidity | 40 to 70% RH |
| Specified storage period | 1 year |
| Reflow preheating temperature | 130°C to 190°C |
| Reflow soldering temperature | 220°C to 230°C |
| Wave soldering temperature | 260°C + 3°C |
| Solder iron temperature limit | ≤ 380°C |
The solder iron temperature should not exceed 380 °C.