Key facts
- Brand
- Torex
- Model
- USP-6C
- Documents
- 3
- Languages
- EN
- Last added
- 2012-03-19
Start here
Torex USP-6C specifications
| Board dimensions | 40 mm × 40 mm (1600 mm² per side) |
|---|---|
| Copper trace coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Through‑hole size | 4 × 0.8 mm |
| Power dissipation at 25 °C | 1000 mW |
| Thermal resistance (85 °C case) | 100 °C/W |
| Thermal resistance (105 °C case) | 100 °C/W |
Source: USP-6C Datasheet
All Torex USP-6C documents by type
User Manual 3
Day-to-day operation, settings and troubleshooting. Start here if the product is already set up.
Datasheet 2
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What is the power dissipation of the USP‑6C at 25 °C ambient temperature?
The datasheet lists a power dissipation of 1000 mW at 25 °C.
From: USP-6C Datasheet
What are the measurement conditions for the power‑dissipation data?
The data were measured on a 40 mm × 40 mm FR‑4 board (1.6 mm thick) with copper covering 50 % of the area, using natural convection cooling and lead‑free solder.
What maximum junction temperature is used in the data?
The board‑mount measurements assume a maximum junction temperature (Tjmax) of 125 °C.