Key facts
- Brand
- Torex
- Model
- SOT-89-5
- Documents
- 3
- Languages
- EN
- Last added
- 2012-03-19
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Torex SOT-89-5 Power Dissipation Manual
This document presents reference power‑dissipation data for the Torex SOT‑89‑5 device. The data were measured on a 40 × 40 mm evaluation board with 50 % copper coverage, FR‑4 substrate (1.6 mm thick), lead‑free solder and natural convection.
Two temperature curves are shown: one for an ambient of 85 °C and another for 105 °C, with the maximum junction temperature limited to 125 °C. The tables list the corresponding power‑dissipation values (in mW) at various ambient temperatures.
Torex SOT-89-5 specifications
| Maximum junction temperature (Tjmax) | 125 °C |
|---|---|
| Power dissipation at 105 °C ambient | 260 mW |
| Evaluation board dimensions | 40 × 40 mm |
| Copper trace coverage on board | 50 % |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Solder type | Lead‑free |
All Torex SOT-89-5 documents by type
Day-to-day operation, settings and troubleshooting. Start here if the product is already set up.
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What is the maximum junction temperature for the SOT‑89‑5?
The maximum junction temperature is specified as 125 °C.
What is the standard feed orientation for SOT-89/89-5?
The standard feed orientation is indicated as Right (R Type) and Left (L Type).
How many pieces are packed per reel for the SOT-89/89-5 package?
Each reel contains 1,000 pieces of the SOT-89/89-5 device.