Key facts
- Brand
- Torex
- Model
- SOP-8FD
- Documents
- 3
- Languages
- EN
- Last added
- 2012-03-19
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Torex SOP-8FD Power Dissipation Data Sheet
This data sheet presents the power dissipation characteristics of the Torex SOP-8FD component. It includes tables of power dissipation versus ambient temperature and the associated thermal resistance values.
The reference measurements were taken with the device mounted on a 40 × 40 mm FR‑4 board, copper traces covering 50 % of the area, natural convection cooling, lead‑free solder, and a board thickness of 1.6 mm. Four 0.8 mm through‑holes were used, and the package heat‑sink was tied to the copper traces. The maximum junction temperature is limited to 125 °C.
Torex SOP-8FD specifications
| Maximum junction temperature (Tj max) | 125 °C |
|---|---|
| Board dimensions (reference) | 40 × 40 mm |
| Copper trace coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Through‑hole count and size | 4 × 0.8 mm |
All Torex SOP-8FD documents by type
Day-to-day operation, settings and troubleshooting. Start here if the product is already set up.
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What is the maximum junction temperature allowed for the SOP‑8FD?
The maximum junction temperature (Tj max) is 125 °C.
What measurement conditions were used for the SOP‑8FD power‑dissipation data?
The data were measured with the package mounted on a board, natural convection cooling, lead‑free solder, FR‑4 material of 1.6 mm thickness, copper traces covering 50 % of the board area, and a heat‑sink tied to the copper traces.
How does power dissipation change with ambient temperature for the SOP‑8FD?
At an ambient temperature of 25 °C the package can dissipate 1500 mW, while at 85 °C the dissipation drops to 600 mW.