USP-6C power dissipation characteristics,USP-6C power dissipation and ambient temperature relation,USP-6C power dissipation and package method relation
This one‑page datasheet provides reference power dissipation values for the USP‑6C under defined board‑mount conditions. It lists the ambient temperature range, board dimensions, material, and copper trace coverage used during testing.
The document includes tables of power dissipation versus ambient temperature and the corresponding thermal resistance, allowing designers to estimate heat performance for the USP‑6C in their applications.
| Board dimensions | 40 mm × 40 mm (1600 mm² per side) |
|---|---|
| Copper trace coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Through‑hole size | 4 × 0.8 mm |
| Power dissipation at 25 °C | 1000 mW |
| Thermal resistance (85 °C case) | 100 °C/W |
| Thermal resistance (105 °C case) | 100 °C/W |
The datasheet lists a power dissipation of 1000 mW at 25 °C.