Key facts
- Brand
- Torex
- Model
- USPN-4
- Documents
- 3
- Languages
- EN
- Last added
- 2012-03-19
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USPN-4 Power Dissipation Data Sheet
This document provides power‑dissipation data for the USPN‑4 semiconductor device. The data are intended for reference when the device is mounted on a standard board under the conditions described.
Measurement conditions include mounting on a 40 × 40 mm FR‑4 board, natural convection ambient, lead‑free soldering, 1.6 mm board thickness, copper traces covering 50 % of both front and back, and four 0.8 mm through‑hole terminals. Power‑dissipation versus ambient temperature curves are given for 85 °C and 105 °C board‑mount scenarios, with a thermal resistance of 166.67 ℃/W.
Torex USPN-4 specifications
| Board dimensions | 40 x 40 mm (1600 mm² per side) |
|---|---|
| Copper trace coverage | 50 % front, 50 % back |
| Package material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Through‑hole size | 4 × 0.8 mm diameter |
| Thermal resistance | 166.67 ℃/W |
All Torex USPN-4 documents by type
Day-to-day operation, settings and troubleshooting. Start here if the product is already set up.
Ratings, dimensions and ordering codes, for selection and design work.
Questions answered in these manuals
What is the thermal resistance of the USPN-4?
The thermal resistance is 166.67 ℃/W.