This document provides reference power‑dissipation data for the Torex USP‑6C component. The values are measured under defined board‑mount conditions and are intended for use as reference when designing with the device.
Measurements were performed on a 40 mm × 40 mm FR‑4 board with 1.6 mm thickness, copper covering 50 % of the area, natural convection cooling, and lead‑free solder. Data are presented for ambient temperatures of 25 °C, 85 °C and 105 °C with a maximum junction temperature of 125 °C.
| Board dimensions | 40 mm × 40 mm |
|---|---|
| Copper coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Lead‑free solder | Yes |
| Maximum junction temperature (Tjmax) | 125 °C |
| Power dissipation at 25 °C ambient | 1000 mW |
The data were measured on a 40 mm × 40 mm FR‑4 board (1.6 mm thick) with copper covering 50 % of the area, using natural convection cooling and lead‑free solder.
The board‑mount measurements assume a maximum junction temperature (Tjmax) of 125 °C.
Power dissipation decreases as ambient temperature rises; for example, at 25 °C ambient the dissipation is 1000 mW, while at 85 °C it drops to 400 mW.