This document provides power dissipation data for SOT-89-5 and describes its power dissipation values and thermal resistance under different conditions. The product is suitable for mounting on a 40×40mm glass epoxy board and has good heat dissipation performance.
This document presents reference power‑dissipation data for the Torex SOT‑89‑5 device. The data were measured on a 40 × 40 mm evaluation board with 50 % copper coverage, FR‑4 substrate (1.6 mm thick), lead‑free solder and natural convection.
Two temperature curves are shown: one for an ambient of 85 °C and another for 105 °C, with the maximum junction temperature limited to 125 °C. The tables list the corresponding power‑dissipation values (in mW) at various ambient temperatures.
| Maximum junction temperature (Tjmax) | 125 °C |
|---|---|
| Power dissipation at 105 °C ambient | 260 mW |
| Evaluation board dimensions | 40 × 40 mm |
| Copper trace coverage on board | 50 % |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Solder type | Lead‑free |
The maximum junction temperature is specified as 125 °C.