Introduce the power dissipation characteristics of SOP-8FD
This data sheet presents the power dissipation characteristics of the Torex SOP-8FD component. It includes tables of power dissipation versus ambient temperature and the associated thermal resistance values.
The reference measurements were taken with the device mounted on a 40 × 40 mm FR‑4 board, copper traces covering 50 % of the area, natural convection cooling, lead‑free solder, and a board thickness of 1.6 mm. Four 0.8 mm through‑holes were used, and the package heat‑sink was tied to the copper traces. The maximum junction temperature is limited to 125 °C.
| Maximum junction temperature (Tj max) | 125 °C |
|---|---|
| Board dimensions (reference) | 40 × 40 mm |
| Copper trace coverage | 50 % of board area |
| Board material | Glass Epoxy (FR‑4) |
| Board thickness | 1.6 mm |
| Through‑hole count and size | 4 × 0.8 mm |
The maximum junction temperature (Tj max) is 125 °C.